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          iNEMI Newsletters — Monthly

          Conference & Workshop Presentations

          iNEMI PCB Roadmap Overview, presented by Steve Payne (iNEMI), EIPC’s 2020 Winter Conference (February 13; Rotterdam, The Netherlands)

          iNEMI PCB Technology Forum at APEX: Emerging Challenges and Technology Needs plus additional conference technical presentations, IPC APEX EXPO 2020 (February 4 & 5; San Diego, California) 

          iNEMI Connector Reliability Test Recommendations Project, presented by Vince Pascucci (TE Connectivity), IPC Wisdom Wednesday Webinar (December 18, 2019)

          iNEMI Panel Session at EPTC: Packaging Challenges & Opportunities for 5G Applications (Electronics Packaging Technology Conference; December 4, 2019; Singapore) 

          Articles & Interviews

          Can Tomorrow’s A&D Designs Handle the Heat? Peter M. Carter (Aeromarc LLC), Printed Circuit Design & Fabrication/Circuits Assembly, April 2020, p 68

          iNEMI CEO Marc Benowitz, interview with REALTIME with IPC APEX EXPO, February 2020

          Grace O’Malley (iNEMI) interview with REALTIME with IPC APEX EXPO, February 2020

          Can PCB Fabrication Processes Keep Up with Design Demands? Steve Payne (iNEMI), Printed Circuit Design & Manufacturing/Circuits Assembly online, February 2020

          Digital Building Blocks: AI and Machine Learning Will Shape the Coming Era of Electronics Manufacturing, Dan Gamota (Jabil) Printed Circuit Design & Fabrication/Circuits Assembly, December 2019

          Project Webinars & Reports

          End-of-Project/Phase 2 and Call-for-Participant/Phase 3 Webinar, Wafer/Panel Level Fine Pitch Inspection/Metrology project (March 5, 2020)

          Sustainable Electronics— Information Webinar on Lack of Harmonization in Materials Regulations and Inefficiencies in Data Collection, March 4, 2020 (available to public)

          Sustainable Electronics Technical Plan, February 19, 2020 (members only; requires log-in)    
                 
          Report    Webinar presentation 

          2020 Packaging Technical Plan — Packaging Technology Challenges and Recommendations, February 12, 2020 (members only; requires log-in)    
                  Report    Webinar presentation   
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