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          iNEMI PCB Technology Forum at APEX Focused on Emerging Challenges & Technology Needs

           
          IPC APEX EXPO 2020 was a great location for iNEMI’s PCB-focused workshop. Lively panels of experts discussed many of the new applications that are demanding innovation and new developments in the PCB supply chain, and what it takes to implement those changes. 
           
          Dr. SK Chiang (Prismark Partners) opened with a discussion of the key market trends that are impacting the PCB industry:  
          • the move to more personal devices such as smart phones, TVs in consumer devices 
          • the growth of data in communications, computing and medical infrastructure 
          • the focus on energy efficient applications, particularly automotive and industrial 
          • the drive to automation, including everything from lights-out factories to driverless cars

          iNEMI
          By iNEMI
          on March 26, 2020 3:22:20 PM EDT
             
          iNEMI PCB Technology Forum at APEX Focused on Emerging Challenges & Technology Needs
           
          IPC APEX EXPO 2020 was a great location for iNEMI’s PCB-focused workshop....
          iNEMI
          By iNEMI
          on March 26, 2020 3:22:20 PM EDT
          iNEMI Project is Analyzing Inspection Capabilities for Fine Pitch Substrates

          Electronic packaging technologies are quickly moving to adopt heterogeneous integrated solutions. However, the fine lines and...

          iNEMI
          By iNEMI
          on March 26, 2020 1:32:24 PM EDT
          PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
          The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated...
          iNEMI
          By iNEMI
          on November 27, 2019 12:01:47 PM EST
          iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging

          The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...

          iNEMI
          By iNEMI
          on November 27, 2019 11:45:54 AM EST
          iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging

           

          New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...

          iNEMI
          By iNEMI
          on September 19, 2019 11:56:00 AM EDT
          iNEMI Workshop Identifies Drivers and Needs for Next-Generation Solder Materials

          iNEMI’s Next-Generation Solder Materials workshop brought together more than 70 industry professionals from across the...

          iNEMI
          By iNEMI
          on May 2, 2019 8:06:58 AM EDT
          iNEMI Team Develops Reuse and Recycling Metric

          If you can’t measure it, you can’t manage it!

          After evaluating existing recyclability and reusability metrics, the iNEMI...

          Lisa Dender, IBM
          By Lisa Dender, IBM
          on January 16, 2019 10:30:09 AM EST
          Written by

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